 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| DFM300BXS12-A000 DFM300BXS12-A000 Fast Recovery Diode Module Replaces DFM300LXS12-A000 PDS5724-1.2 July 2004 FEATURES I Low Reverse Recovery Charge I High Switching Speed I Low Forward Voltage Drop I Isolated Base KEY PARAMETERS VRRM VF (typ) (max) IF (max) IFM 1200V 2.0V 300A 600A APPLICATIONS I Chopper Diodes I Boost and Buck Converters I Free-wheel Circuits I Snubber Circuits I Resonant Converters I Multi-level Switch Inverters The DFM300BXS12-A000 is a single 1200 volt, fast recovery diode (FRD) module. Designed for low power loss, the module is suitable for a variety of high voltage applications in motor drives and power conversion. Fast switching times and low reverse recovery losses allow high frequency operation making the device suitable for the latest drive designs employing pwm and high frequency switching. These modules incorporate electrically isolated base plates and low inductance construction enabling circuit designers to optimise circuit layouts and utilise grounded heat sinks for safety. 2 1 Fig. 1 Circuit diagram ORDERING INFORMATION Order As: DFM300BXS12-A000 Note: When ordering, please use the complete part number. Outline type code: B (See package details for further information) Fig. 2 Electrical connections - (not to scale) 1/7 www.dynexsemi.com DFM300BXS12-A000 ABSOLUTE MAXIMUM RATINGS Stresses above those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. In extreme conditions, as with all semiconductors, this may include potentially hazardous rupture of the package. Appropriate safety precautions should always be followed. Exposure to Absolute Maximum Ratings may affect device reliability. Tcase = 25C unless stated otherwise Symbol VRRM IF IFM IFSM I2t Pmax Visol Qpd Parameter Repetitive peak reverse voltage Forward current (per arm) Max. forward current Surge (non-repetitive) forward current I2t value fuse current rating Maximum power dissipation Isolation voltage Partial discharge VR = 0, tp = 10ms, Tvj = 125C Tcase = 25C, Tvj = 125C Commoned terminals to base plate. AC RMS, 1 min, 50Hz IEC1287. V1 = 1200V, V2 = 900V, 50Hz RMS Tvj = 125C DC, Tcase = 70C, Tvj = 125C Tcase = 110C, tp = 1ms Test Conditions Max. 1200 300 600 2236 25 1.0 2.5 10 Units V A A A kA2s kW kV pC THERMAL AND MECHANICAL RATINGS Internal insulation: Baseplate material: Creepage distance: Symbol Rth(j-c) Al2O3 Cu 20mm Clearance: 11mm CTI (Critical Tracking Index): 425 Parameter Thermal resistance - diode (per arm) Test Conditions Continuous dissipation junction to case Min. - Typ. - Max. 100 Units C/kW Rth(c-h) Thermal resistance - case to heatsink (per module) Mounting torque 5Nm (with mounting grease) Mounting - M6 Electrical connections - M6 - - 15 C/kW Tj Tstg - Junction temperature Storage temperature range Screw torque -40 3 2.5 - 125 125 5 5 C C Nm Nm 2/7 www.dynexsemi.com DFM300BXS12-A000 STATIC ELECTRICAL CHARACTERISTICS Tvj = 25C unless stated otherwise. Symbol IRM VF Parameter Peak reverse current Forward voltage Test Conditions VR = 1200V, Tvj = 125C IF = 300A IF = 300A, Tvj = 125C L Inductance (module) Min. Typ. 2.0 2.05 16 Max. 8 2.5 2.55 Units mA V V nH DYNAMIC ELECTRICAL CHARACTERISTICS Tvj = 25C unless stated otherwise. Symbol trr Irr Qrr Erec Parameter Reverse recovery time Reverse recovery current Reverse recovery charge Reverse recovery energy Test Conditions IF = 300A, dIF/dt = 2250A/s, VR = 600V Min. Typ. 0.4 300 55 17 Max. Units s A C mJ Tvj = 125C unless stated otherwise. Symbol trr Irr Qrr Erec Parameter Reverse recovery time Reverse recovery current Reverse recovery charge Reverse recovery energy Test Conditions IF = 300A, dIF/dt = 2250A/s, VR = 600V Min. Typ. 0.5 320 85 32 Max. Units s A C mJ 3/7 www.dynexsemi.com DFM300BXS12-A000 TYPICAL CHARACTERISTICS 800 Tj = 25C Tj = 125C 700 VF is measured at power busbars and not the auxiliary terminals 100 600 Forward current, IF - (A) Transient thermal impedance, Zth (j-c) - (C/kW ) 10 500 400 300 1 200 100 Diode 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 Ri (C/KW) i (ms) 0.01 1 2.24 0.10 2 12.64 3.21 3 37.12 38.58 1 4 45.02 113.97 10 0.1 0.001 Forward voltage, VF - (V) 0.1 Pulse width, tp - (s) Fig.3 Diode typical forward characteristics 1200 500 Fig.4 Transient thermal impedance 1000 400 Fowrad current, IF - (A) 25 50 75 100 125 Power dissipation - (W) 800 300 600 200 400 100 200 0 0 0 0 25 Case temperature, Tc - C 50 75 Case temperature, Tc - (C) 100 125 Fig.5 Power dissipation Fig.6 DC current rating vs case temperature 4/7 www.dynexsemi.com DFM300BXS12-A000 600 Tcase =125C 500 Reverse recovery current, Irr - (A) 400 300 200 100 0 0 200 400 600 800 1000 1200 1400 Reverse voltage, VR - (V) Fig.7 RBSOA 5/7 www.dynexsemi.com DFM300BXS12-A000 PACKAGE DETAILS For further package information, please visit our website or contact Customer Services. All dimensions in mm, unless stated otherwise. DO NOT SCALE. 2 1 Nominal weight: 475g Module outline type code: B Fig. 8 Package details 6/7 www.dynexsemi.com POWER ASSEMBLY CAPABILITY The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconductor, and has developed a flexible range of heatsink and clamping systems in line with advances in device voltages and current capability of our semiconductors. We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The Assembly group offers high quality engineering support dedicated to designing new units to satisfy the growing needs of our customers. Using the latest CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete Solution (PACs). HEATSINKS The Power Assembly group has its own proprietary range of extruded aluminium heatsinks which have been designed to optimise the performance of Dynex semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on request. For further information on device clamps, heatsinks and assemblies, please contact your nearest sales representative or Customer Services. http://www.dynexsemi.com e-mail: power_solutions@dynexsemi.com HEADQUARTERS OPERATIONS DYNEX SEMICONDUCTOR LTD Doddington Road, Lincoln. Lincolnshire. LN6 3LF. United Kingdom. Tel: +44-(0)1522-500500 Fax: +44-(0)1522-500550 CUSTOMER SERVICE Tel: +44 (0)1522 502753 / 502901. Fax: +44 (0)1522 500020 SALES OFFICES Benelux, Italy & Switzerland: Tel: +33 (0)1 60 69 32 36. Fax: +33 (0)1 60 69 31 97. France: Tel: +33 (0)2 47 55 75 53. Fax: +33 (0)2 47 55 75 59. Tel: +33 (0)1 60 69 32 36. Fax: +33 (0)1 60 69 31 97 Germany, Northern Europe, Spain & Rest Of World: Tel: +44 (0)1522 502753 / 502901. Fax: +44 (0)1522 500020 North America: Tel: (440) 259-2060. Fax: (440) 259-2059. Tel: (949) 733-3005. Fax: (949) 733-2986. These offices are supported by Representatives and Distributors in many countries world-wide. (c) Dynex Semiconductor 2003 TECHNICAL DOCUMENTATION - NOT FOR RESALE. PRODUCED IN UNITED KINGDOM This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request. All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners. www.dynexsemi.com |
Price & Availability of DFM300BXS12-A000
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |